Title:
レーザー加工装置
Document Type and Number:
Japanese Patent JP2007532322
Kind Code:
A
Abstract:
Disclosed is a laser processing apparatus for minimizing generation of sludge and enhancing the processing efficiency while processing an object. The laser processing apparatus includes a beam irradiator for emitting a laser beam from a laser light source, a beam scanner for operating the laser beam emitted from the beam scanner, to be irradiated on a predetermined interval of a processing position of the object repeatedly on the straight, and a condensing lens for regulating a focus of the laser beam emitted from the beam irradiator. The object is movable at least once along a processing direction during processing the object. According to the present invention, it is able to improve the processing efficiency and to work an object with a uniform morphology by using a mask filtering a laser beam irradiated at a rotation turning point of a beam scanning mirror, capable of continuously irradiating a laser beam by deforming the laser beam into an elliptical pattern.
Inventors:
Han Young
Hong Eun Jeon
Lee Hak Young
Jun Wonchul
Hong Eun Jeon
Lee Hak Young
Jun Wonchul
Application Number:
JP2007509387A
Publication Date:
November 15, 2007
Filing Date:
June 02, 2004
Export Citation:
Assignee:
EO Technics Company Limited
International Classes:
H01L21/78; B23K26/064; B23K26/066; B23K26/073; B23K26/08
Domestic Patent References:
| JP2002361449A | 2002-12-18 | |||
| JP2002028798A | 2002-01-29 | |||
| JPH08197271A | 1996-08-06 |
Attorney, Agent or Firm:
Tsutomu Adachi
Ishihara
Ishihara