Title:
銅を転化するためのプロセス
Document Type and Number:
Japanese Patent JP2007532771
Kind Code:
A
Abstract:
The process for converting a copper sulphide matte to blister copper, is achieved by adding the copper sulphide matte and flux to a suitable agitated slag phase; and injecting, from a discharge tip at the lower end of a top-submerged lance, an oxidizing gas suitable for reacting with the matte to produce blister copper which forms or adds to a continuous blister copper phase below the slag phase. The lance tip is located within the slag phase at a depth enabling the injected gas to agitate the slag phase, and to react with copper sulphide matte dispersed therein, while precluding a substantial proportion of the gas from contacting the continuous blister copper phase.
Inventors:
Hughes, Stefan, Peter
Matsusevix, robert
McClealand, Ross Alexander
AQUADRO, Antony
Baldock, Bryan, Ross
Matsusevix, robert
McClealand, Ross Alexander
AQUADRO, Antony
Baldock, Bryan, Ross
Application Number:
JP2007506614A
Publication Date:
November 15, 2007
Filing Date:
April 06, 2005
Export Citation:
Assignee:
Ausmelt Limited
International Classes:
C22B15/06; C22B5/10; C22B5/12; C22B9/10; C22B15/00; F27B3/22
Domestic Patent References:
| JPH10502127A | 1998-02-24 | |||
| JP2003148875A | 2003-05-21 | |||
| JP2002317229A | 2002-10-31 | |||
| JP2002275554A | 2002-09-25 |
Attorney, Agent or Firm:
Alga Patent Office, a patent business corporation
Miyuki Ariga
Toshio Takano
Toshio Nakajima
Masaki Murata
Hiroto Yamamoto
Hiromi Matoba
Moriya Kataka
Ohno Shiki
Masahiro Matsuda
Nobuhiro Nonaka
Miyuki Ariga
Toshio Takano
Toshio Nakajima
Masaki Murata
Hiroto Yamamoto
Hiromi Matoba
Moriya Kataka
Ohno Shiki
Masahiro Matsuda
Nobuhiro Nonaka