Title:
多層プリント配線板
Document Type and Number:
Japanese Patent JP2007535179
Kind Code:
A
Abstract:
A multilayer printed circuit board can be used in high-frequency applications, is not easily affected by environmental changes, and has stable dielectric characteristics. A multilayer printed circuit board suitable for use in the high-frequency range includes at least two printed wiring sheets laminated with an interlayer bonding member therebetween. At least one of the at least two printed wiring sheets includes an insulating film, an adhesive layer containing a thermoplastic polyimide disposed on at least one surface of the insulating film, and a metal wiring layer disposed on the adhesive layer. The interlayer bonding member contains a thermoplastic polyimide.
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| JP2599424 | [Title of Invention] Electronic Circuit Unit |
| JP6432460 | DC-DC converter |
| JPS62232995 | MULTILAYER INTERCONNECTION BOARD |
Inventors:
Tsuyoshi Kikuchi
Shigeru Tanaka
Eiichiro Kuribayashi
Greg Clements
Shigeru Tanaka
Eiichiro Kuribayashi
Greg Clements
Application Number:
JP2007510908A
Publication Date:
November 29, 2007
Filing Date:
April 27, 2005
Export Citation:
Assignee:
Kaneka Texas Corporation
Kaneka Corporation
Kaneka Corporation
International Classes:
H05K3/46; H05K1/03; H05K3/38
Domestic Patent References:
| JPH05343822A | 1993-12-24 | |||
| JP2004095963A | 2004-03-25 | |||
| JPS5732943A | 1982-02-22 | |||
| JP2002344124A | 2002-11-29 | |||
| JP2003268327A | 2003-09-25 |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office