Title:
バルク熱伝導率を増大させるためのナノ材料含有有機マトリックス
Document Type and Number:
Japanese Patent JP2007538135
Kind Code:
A
Abstract:
Thermal interface compositions contain nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles. In certain embodiments, a thermal interface composition (2) is positioned between a heat producing component (3) and a heat sink.
Inventors:
Tson, Hong
Rubin Tutain, Slavomier
Rubin Tutain, Slavomier
Application Number:
JP2007527154A
Publication Date:
December 27, 2007
Filing Date:
May 20, 2004
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
C08L101/00; C08K9/06; C09K5/14; H01L23/36; H01L23/373; H05K1/03
Domestic Patent References:
| JP2003342021A | 2003-12-03 | |||
| JPH04356934A | 1992-12-10 |
Foreign References:
| WO2004024811A2 | 2004-03-25 | |||
| WO2004048266A1 | 2004-06-10 |
Attorney, Agent or Firm:
Masayuki Masabayashi
Kenichi Matsumoto
Hirokazu Ogura
Toshihisa Kurokawa
Arakawa Satoshi
Kenichi Matsumoto
Hirokazu Ogura
Toshihisa Kurokawa
Arakawa Satoshi