Title:
粘土及びCeO2の研磨粒子を含むスラリーの化学的-機械的研磨(CMP)と表面を平坦化する方法
Document Type and Number:
Japanese Patent JP2008502776
Kind Code:
A
Abstract:
A composition for planarizing or polishing a surface comprising (a) a liquid carrier, and (b) solids comprising about 0.1 to about 10% by weight clay abrasive particles, and about 0.1% to about 50% by weight CeO2 particles, based on the total weight of solids in the composition, said clay and CeO2 abrasive particles having a particle size such that at least 90% of the particles (by number), when slurried in water, have a particle size in the range of about 10 nm to about 10 mum.
Inventors:
Minh Minh Fan
Michael Earl Ianilo
Don Eisenhower
Michael Earl Ianilo
Don Eisenhower
Application Number:
JP2007516598A
Publication Date:
January 31, 2008
Filing Date:
June 14, 2005
Export Citation:
Assignee:
Amcol International Corporation
International Classes:
C09K3/14; B24B37/00; C03C19/00; C09G1/02; H01L21/00; H01L21/304; H01L21/3105; H01L21/321
Attorney, Agent or Firm:
Minoru Torinosu
Shinichi Nakajima
Shinichi Nakajima