Title:
チップ用ヒューズ
Document Type and Number:
Japanese Patent JP2008505466
Kind Code:
A
Abstract:
To produce a cost-effective fuse in chip design, which is applied to a carrier substrate made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor and a cover layer, in which the melting point of the metallic conductor may be defined reliably, it is suggested that an intermediate layer having low thermal conductivity be positioned between the carrier substrate and the metallic conductor, the intermediate layer being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer applied in island printing. Furthermore, a method for manufacturing the fuse is specified.
Inventors:
Bram, Werner
Friedrich, Reinell
Werner, Wolfgang
Hinrichs, Reimel
Friedrich, Reinell
Werner, Wolfgang
Hinrichs, Reimel
Application Number:
JP2007519668A
Publication Date:
February 21, 2008
Filing Date:
June 27, 2005
Export Citation:
Assignee:
Fishay Bezecom Ponents Bay Shrug Game Beha
International Classes:
H01H85/17; H01H69/02; H01H85/046; H01H85/06; H01H85/08
Domestic Patent References:
| JPH09129115A | 1997-05-16 | |||
| JPH1050198A | 1998-02-20 | |||
| JPH09153328A | 1997-06-10 | |||
| JPH0963454A | 1997-03-07 | |||
| JP2001052593A | 2001-02-23 |
Attorney, Agent or Firm:
Yasushi Shinohara
Masayuki Fujinaka
Masayuki Fujinaka