Title:
集積回路基板を洗浄するのに使用される洗浄液を帯電させるためのシステムおよび方法
Document Type and Number:
Japanese Patent JP2008506266
Kind Code:
A
Abstract:
Inventive methods, systems and compositions of cleaning integrated circuit (IC) substrates are described. The cleaning methods of the present invention include: charging a solution, which contains at least a solute selected to promote cleaning of the IC substrate, to produce a charged solution, such that at least a portion of the solute is present as clusters in the charged solution; and conveying the charged solution for cleaning the IC substrate. The cleaning systems of the present invention include: a charging chamber for holding a solution, which contains at least a solute selected to promote cleaning of the integrated circuit substrate; and a first acoustic energy source capable of vibrating the solution in the charging chamber to produce a charged solution such that at least a portion of the solute is present as clusters in the charged solution. The cleaning compositions of the present invention include: a solvent; and a solute selected to promote cleaning of the IC substrate, wherein at least a portion of the solute is present in cluster form in the solution and the solute and solvent are present in a volumetric ratio that is between about 3×10−5:1 and about 1×10−24:1.
Inventors:
Slaj puri
Application Number:
JP2007520560A
Publication Date:
February 28, 2008
Filing Date:
July 07, 2005
Export Citation:
Assignee:
Slaj puri
International Classes:
H01L21/304; H01L21/306
Domestic Patent References:
| JPH08187474A | 1996-07-23 | |||
| JP2002367949A | 2002-12-20 | |||
| JP2002543976A | 2002-12-24 | |||
| JP2002219467A | 2002-08-06 |
Foreign References:
| WO2000024687A1 | 2000-05-04 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro