Title:
高密度研磨材成形体
Document Type and Number:
Japanese Patent JP2008512259
Kind Code:
A
Abstract:
A method of producing a high-density abrasive compact material includes the steps of providing an electrically conductive mixture of a bonding powder material and abrasive particles or grit; compressing the electrically conductive mixture; and subjecting the compressed electrically conductive mixture to one or more high current pulses to form the abrasive compact is provided.
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Inventors:
Egan, David
Flynn, Gerald, F.
Flynn, Gerald, F.
Application Number:
JP2007530788A
Publication Date:
April 24, 2008
Filing Date:
September 09, 2005
Export Citation:
Assignee:
Element Six Limited
International Classes:
B24D3/00; B24D3/06
Domestic Patent References:
| JPH09194978A | 1997-07-29 | |||
| JPH07316609A | 1995-12-05 | |||
| JPH10296636A | 1998-11-10 | |||
| JP2004011006A | 2004-01-15 | |||
| JPH0525462A | 1993-02-02 | |||
| JP2002069560A | 2002-03-08 | |||
| JPH10310840A | 1998-11-24 |
Foreign References:
| DE19827665A1 | 1999-12-23 |
Attorney, Agent or Firm:
Hideto Asamura
Hajime Asamura
Yuichiro Asano
Katsunori Ando
Hajime Asamura
Yuichiro Asano
Katsunori Ando