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Title:
3段スタックモールド成形機
Document Type and Number:
Japanese Patent JP2008515678
Kind Code:
A
Abstract:
A three level stack mold machine comprising a machine frame, a fixed platen mounted on the frame, guide rails mounted on the frame, a movable platen mounted on the guide rails and two carriages mounted on the guide rails between the fixed platen and the movable platen. A hot runner plate is mounted on the fixed platen and water manifolds are mounted on each carriage assembly. Each manifold has water connectors extending upwardly therefrom. A hot runner plate is mounted on each manifold and connected to a first group of the water connectors. A core plate is mounted on the movable platen and connected to water connectors extending upwardly from a water manifold attached to the movable platen. Core plates are mounted on the hot runner plates on the carriage assemblies. The core plates have water connectors on a bottom surface thereof connected to a second group of the water connectors. Cavity plates are mounted on the hot runner plates and connected to hot runner nozzles extending out of the hot runner plates. The cavity plates are orientated in a uniform direction. Air connectors are provided at a top surface of the core plates and electrical connectors at a top surface of the hot runners.

Inventors:
Digimonet, john
Gracener, pierre
Application Number:
JP2007535960A
Publication Date:
May 15, 2008
Filing Date:
September 07, 2005
Export Citation:
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Assignee:
HUSKY INJECTION MOLDING SYSTEMS LIMITED
International Classes:
B29C45/32; B29C45/66; B29C45/73
Domestic Patent References:
JPH10315281A1998-12-02
JPS58201622A1983-11-24
JPH0361519A1991-03-18
Foreign References:
US5562935A1996-10-08
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Okabe
Shinichi Usui
Takao Ochi
Seiichiro Takahashi
Koji Yoshizawa
Takao Matsui
Naoki Kimiya