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Title:
MEMSデバイス用のバネ構造体
Document Type and Number:
Japanese Patent JP2008517784
Kind Code:
A
Abstract:
A MEM device has a movable element (30), a pair of electrodes (e1, e2) to move the movable element, one electrode having an independently movable section (e3), resiliently coupled to the rest of the respective electrode to provide additional resistance to a pull in of the electrodes. This can enable a higher release voltage Vrel, and thus reduced risk of stiction. Also, a ratio of Vpi to Vrel can be reduced, and so a greater range of voltage is available for movement of the movable element. This enables faster switching. The area of the independently movable section is smaller than the rest of the electrode, and the spring constant of the resilient coupling is greater than that of the flexible support. Alternatively, the movable element can have a movable stamp section resiliently coupled and protruding towards the substrate to provide an additional resistance to pull in when it contacts the substrate.

Inventors:
Peter, H. Steeneken
Joseph, Thomas, Martinus, Fan, Bake
Theo, Lakes
Application Number:
JP2007538568A
Publication Date:
May 29, 2008
Filing Date:
October 24, 2005
Export Citation:
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Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
B81B3/00; H01P1/12; H01H59/00
Domestic Patent References:
JP2004200151A2004-07-15
Foreign References:
WO1999021204A11999-04-29
DE4205340C11993-08-05
US20020075626A12002-06-20
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Takahashi