Title:
高分子樹脂微粒子、導電性微粒子及びこれを含んだ異方導電性接続材料
Document Type and Number:
Japanese Patent JP2008521963
Kind Code:
A
Abstract:
Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.
Inventors:
Jun Jung Bae
Park Jin Gyu
Li Jae Ho
Petesap
Park Jin Gyu
Li Jae Ho
Petesap
Application Number:
JP2007542878A
Publication Date:
June 26, 2008
Filing Date:
June 27, 2005
Export Citation:
Assignee:
Cheil Industries Inc.
International Classes:
C08F212/00; C08F2/44; C08F220/20; C08F220/56; C08F222/26; C08F226/06; C08F228/06; C08J7/06
Domestic Patent References:
| JP2004165019A | 2004-06-10 | |||
| JP2004111163A | 2004-04-08 | |||
| JPH11241054A | 1999-09-07 | |||
| JP2004342764A | 2004-12-02 | |||
| JP2004346247A | 2004-12-09 | |||
| JP2003313304A | 2003-11-06 | |||
| JP2000319309A | 2000-11-21 | |||
| JPH11329059A | 1999-11-30 |
Attorney, Agent or Firm:
Hatta International Patent Corporation