Title:
密閉サイクルでの熱伝達流体を利用した向流熱電構成
Document Type and Number:
Japanese Patent JP2008528912
Kind Code:
A
Abstract:
Active cooling technologies such as thermoelectrics can be used to introduce thermal "gain" into a cooling system and, when employed in combination with forced flow liquid metal cooling loops, can provide an attractive solution for cooling high heat flux density devices and/or components. Total cooling power can be increased by employing multiple thermoelectric elements. Indeed, by employing modern semiconductor technologies, including e.g., thin-film technologies, thermoelectric elements may be cost-effectively employed and configured in large arrays.
Inventors:
Gothal, uttam
Application Number:
JP2007548535A
Publication Date:
July 31, 2008
Filing Date:
December 22, 2005
Export Citation:
Assignee:
NANOCOOLERS, INC.
International Classes:
F25B21/02; H01L35/30
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa