Title:
ポリマー表面への材料の移動
Document Type and Number:
Japanese Patent JP2008533263
Kind Code:
A
Abstract:
A method of providing at least one heat sensitive material on at least part of a surface of a polymer article formed from a heated polymer whose temperature is sufficient to adversely affect the at least one heat sensitive material, wherein an at least partly textured shaping surface is provided. The heat sensitive material is applied to at least part of the shaping surface, the shaping surface being at a temperature at which the heat sensitive material is not adversely affected. The heated polymer is brought in contact with the shaping surface and formed by the surface shape of the shaping surface. The at least one heat sensitive material is transferred from the shaping surface to the polymer surface, while maintaining sufficiently low the temperature of the shaping surface so that the heat sensitive material is not substantially adversely affected by heat upon or after contact with the heated polymer.
Inventors:
Larsen, Neil's Bent
Nyrap, Susan, Black
Henrik, Planov
Nyrap, Susan, Black
Henrik, Planov
Application Number:
JP2008501297A
Publication Date:
August 21, 2008
Filing Date:
March 15, 2006
Export Citation:
Assignee:
Inmold Biosystems A/S
International Classes:
B29C37/00; B29C45/14; C08J7/043; C08J7/056; B01L3/00
Domestic Patent References:
| JPH07266352A | 1995-10-17 | |||
| JPH07309706A | 1995-11-28 | |||
| JPS60264215A | 1985-12-27 | |||
| JPH01154414A | 1989-06-16 |
Attorney, Agent or Firm:
Yasuo Ishikawa
Yoshinori Ishibashi
Yoshinori Ishibashi