Title:
圧縮可能なセンサ本体を用いる圧力センサ
Document Type and Number:
Japanese Patent JP2008542717
Kind Code:
A
Abstract:
A pressure sensor including a deformable sensor body formed of a compressible material. A deformation sensor is embedded in the deformable sensor body and has an electrical property which changes in response to deformation of the deformable sensor body. Electrical connections which extend from outside the deformable sensor body to the embedded deformation sensor to provide an indication of an applied line pressure or differential pressure.
Inventors:
Broden, David, A.
Hedke, Robert, Sea.
Hedke, Robert, Sea.
Application Number:
JP2008513634A
Publication Date:
November 27, 2008
Filing Date:
May 23, 2006
Export Citation:
Assignee:
Rosemount Incorporated
International Classes:
G01L9/04; G01L15/00; G01L13/06
Domestic Patent References:
| JPH09145511A | 1997-06-06 | |||
| JPS5882640U | 1983-06-04 | |||
| JPH0629821B2 | 1994-04-20 | |||
| JPH0347104U | 1991-05-01 | |||
| JPS54123077A | 1979-09-25 | |||
| JPH01141328A | 1989-06-02 | |||
| JPS61104236A | 1986-05-22 |
Attorney, Agent or Firm:
Kaori Tanaka
Michito Hiraki
Sanji Tanabe
Michito Hiraki
Sanji Tanabe