Title:
プリメタルおよび/またはシャロートレンチアイソレーションに用いられるスピン-オン誘電体材料のための紫外線硬化処理方法
Document Type and Number:
Japanese Patent JP2008544484
Kind Code:
A
Abstract:
A UV curing process for a dielectric material used in pre-metal and shallow trench isolation applications comprises coating a suitable dielectric material onto a substrate; and exposing the dielectric material to ultraviolet radiation in an amount effective to reduce an organic content and/or increase a density and/or increase a wet etch resistance of the dielectric material. Optionally, the UV cured dielectric material may be exposed to multiple ultraviolet radiation patterns.
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Inventors:
Bald Fried Carlow
Escorcia orlando
Escorcia orlando
Application Number:
JP2008515678A
Publication Date:
December 04, 2008
Filing Date:
June 09, 2005
Export Citation:
Assignee:
Axcelis Technologies, Inc.
International Classes:
H01L21/76; H01L21/312; H01L21/768; H01L23/522
Domestic Patent References:
| JP2004274052A | 2004-09-30 | |||
| JP2005503673A | 2005-02-03 |
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Mitsuo Tateishi
Kaoru Onozuka
Akio Tagami
High Masahiro
Toshio Nakamura
Tsutomu Kato
Miyazaki Yoshio
Mitsuo Tateishi
Kaoru Onozuka
Akio Tagami
High Masahiro
Toshio Nakamura
Tsutomu Kato