Title:
温度測定用センサ構成
Document Type and Number:
Japanese Patent JP2009505042
Kind Code:
A
Abstract:
In a sensor arrangement (1) for measuring the temperature of a surface, in particular of a pane (2), comprising a temperature sensor (3) that is disposed on a circuit board (4) and positioned at a front end of the circuit board (4) in the direct vicinity of the surface, a flexible heat conducting element (7) is provided between the surface and the circuit board (4).
Inventors:
Mao ghat
Rabb Christoph
Stauss Gerold
Rabb Christoph
Stauss Gerold
Application Number:
JP2008525373A
Publication Date:
February 05, 2009
Filing Date:
June 29, 2006
Export Citation:
Assignee:
sitronic Ges. fur elektrotechnische Ausrustung mbH & Co. KG
International Classes:
G01K1/14
Domestic Patent References:
| JP2004163291A | 2004-06-10 | |||
| JP2003202311A | 2003-07-18 | |||
| JP2003307457A | 2003-10-31 | |||
| JPH09114314A | 1997-05-02 | |||
| JPH0545234A | 1993-02-23 | |||
| JP3481748B2 | 2003-12-22 | |||
| JP2004163291A | 2004-06-10 | |||
| JP2003202311A | 2003-07-18 |
Attorney, Agent or Firm:
Another role Shigehisa
Satoshi Muramatsu
Satoshi Muramatsu