Title:
金属相互接続構造体
Document Type and Number:
Japanese Patent JP2009509319
Kind Code:
A
Abstract:
An interconnect structure and method of making the same are provided. The interconnect structure includes a dielectric layer having a patterned opening, a metal feature disposed in the patterned opening, and a dielectric cap overlying the metal feature. The dielectric cap has an internal tensile stress, the stress helping to avoid electromigration from occurring in a direction away from the metal line, especially when the metal line has tensile stress.
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Inventors:
Yang, Qi-Chao
Chanda, Kausik
Lawrence, Clevenger
One, Yun-You
Yang, Dewon
Chanda, Kausik
Lawrence, Clevenger
One, Yun-You
Yang, Dewon
Application Number:
JP2008530486A
Publication Date:
March 05, 2009
Filing Date:
September 06, 2006
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
H01L21/768; H01L21/3205; H01L23/52; H01L23/522
Domestic Patent References:
| JP2005513766A | 2005-05-12 | |||
| JP2005515634A | 2005-05-26 | |||
| JPH10189577A | 1998-07-21 | |||
| JP2004158832A | 2004-06-03 | |||
| JP2003017496A | 2003-01-17 | |||
| JP2004080017A | 2004-03-11 | |||
| JPH11284148A | 1999-10-15 | |||
| JP2004095865A | 2004-03-25 | |||
| JP2005513766A | 2005-05-12 | |||
| JP2005515634A | 2005-05-26 | |||
| JPH10189577A | 1998-07-21 | |||
| JP2004158832A | 2004-06-03 | |||
| JP2003017496A | 2003-01-17 |
Attorney, Agent or Firm:
Takeshi Ueno
Tasaichi Tanae
Yoshihiro City
Hiroshi Sakaguchi
Tasaichi Tanae
Yoshihiro City
Hiroshi Sakaguchi