Title:
制御された細孔径を有する微孔質CMP材料の製造方法
Document Type and Number:
Japanese Patent JP2009514690
Kind Code:
A
Abstract:
A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to produce an interpenetrating polymeric network comprising a continuous polymer-rich phase interspersed with a continuous polymer-depleted phase in which the polymer-depleted phase constitutes about 20 to about 90 percent of the combined volume of the phases; (c) solidifying the continuous polymer-rich phase to form a porous polymer sheet; (d) removing at least a portion of the polymer-depleted phase from the porous polymer sheet; and (e) forming a CMP pad therefrom. The method provides for microporous CMP pads having a porosity and pore size that can be readily controlled by selecting the concentration polymer resin in the polymer solution, selecting the solvent based on the solubility parameters of the polymer in the solvent polarity of solvent, selecting the conditions for phase separation, and the like.
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Inventors:
Prasad, Avanshwar
Application Number:
JP2008538918A
Publication Date:
April 09, 2009
Filing Date:
October 24, 2006
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORPORATION
International Classes:
B24B37/00; B24B1/00; B24B29/00; B24B37/04; B24B49/12; B24D7/12; C08J9/28; H01L21/304
Domestic Patent References:
| JP2005532176A | 2005-10-27 | |||
| JP2004337986A | 2004-12-02 | |||
| JP2005034971A | 2005-02-10 | |||
| JPH08293477A | 1996-11-05 |
Foreign References:
| US20040082276A1 | 2004-04-29 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Atsushi Ebiya
Shunsuke Mima
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Atsushi Ebiya
Shunsuke Mima