Title:
CMP後洗浄プロセスのための防腐剤を含む洗浄溶液
Document Type and Number:
Japanese Patent JP2009531512
Kind Code:
A
Abstract:
Post CMP cleaning solutions are provided including at least one cleaning agent comprising an organic acid compound, at least one preservative compound that substantially minimizes or prevents microbial growth in the cleaning solution, and at least one amine compound. The preservative compound can be another organic acid compound that protects the cleaning solution against microbial growth. The cleaning solutions preferably have a pH ranging from about 2 to about 7.
Inventors:
Fisher, Matthew
Mithra, Ashtosh
Mithra, Ashtosh
Application Number:
JP2009502235A
Publication Date:
September 03, 2009
Filing Date:
March 13, 2007
Export Citation:
Assignee:
Rail Liquide-Societe Anonym Pools Retude e Rex Prosatation de Procede Georges Claude
International Classes:
C11D3/48; C11D3/20; C11D3/30; C11D7/26; C11D7/32; H01L21/304
Attorney, Agent or Firm:
Takehiko Suzue
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Katsu Sunagawa
Tetsuya Kazama
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Katsu Sunagawa
Tetsuya Kazama