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Title:
生体組織の細胞または神経に接触するか、あるいは、電気刺激を与える多層移植構造体の製造方法
Document Type and Number:
Japanese Patent JP2009533106
Kind Code:
A
Abstract:
The object, to create a method for producing multilayers or multilayer systems wherein the structures generated on a substrate can easily be jointly detached from the substrate and are preserved in a composite, is achieved by the present invention by means of a method for producing implant structures comprising generating a first metal layer on a substrate, generating a second metal layer above the first metal layer, producing a number of multilayered implant structures above the second metal layer, removing the first metal layer between the substrate and the second metal layer, and releasing the implant structures from the substrate in a coherent composite. With the method according to the invention, between the implant structures and the substrate a release layer is generated consisting of two or three metal layers which serve as sacrificial layer in the course of releasing the fully processed multilayers by means of an under-etching process. As a result, a uniform and reliable separation of the finished multilayers from the substrate in a composite is achieved, facilitating the subsequent technology for assembly and interconnection of the implant structures.

Inventors:
Tietoke, Hans-Jürgen
Application Number:
JP2009504578A
Publication Date:
September 17, 2009
Filing Date:
January 26, 2007
Export Citation:
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Assignee:
I M Intelligent Medical Implants Actien Gezel Shaft
International Classes:
A61B5/296; A61N1/05; A61F2/14; A61F2/18; A61F9/08; A61F11/00
Domestic Patent References:
JP2000502922A2000-03-14
JP2001252897A2001-09-18
JP2004535604A2004-11-25
JP2004141978A2004-05-20
JP2005515819A2005-06-02
JPH02257635A1990-10-18
Foreign References:
US20050164376A12005-07-28
Attorney, Agent or Firm:
Kenzo Hara International Patent Office