Title:
バンド従動パッケージおよびそのコンポーネントの製造
Document Type and Number:
Japanese Patent JP2009535268
Kind Code:
A
Abstract:
Methods are disclosed for making a band-driven package (72) or a band-drive component for a package, and machines for performing the methods. One method comprises providing a substrate (10) encircled by a band (20), the band being defined by web portions joined to each other at at least one join (48) outboard of an edge (28,26) of the substrate (10); and advancing the band around the substrate (10) to move the join inboard of said edge (28,26) of the substrate (10).
Inventors:
Wood, timothy, michael
Howson, adrian, james, david
Duncray, Ian
Ferreman, Sirire
Vipkh, Alfred
Kummer, Daniel
Howson, adrian, james, david
Duncray, Ian
Ferreman, Sirire
Vipkh, Alfred
Kummer, Daniel
Application Number:
JP2009508481A
Publication Date:
October 01, 2009
Filing Date:
May 04, 2007
Export Citation:
Assignee:
Duff Design Limited
International Classes:
B65B27/08; B65B9/02
Domestic Patent References:
| JPH0257518A | 1990-02-27 | |||
| JP2002533274A | 2002-10-08 |
Foreign References:
| US3580786A | 1971-05-25 | |||
| GB2265877B | 1996-01-17 |
Attorney, Agent or Firm:
Shuichiro Kitamura
Mountain Saki Tetsuya
Kunihiko Higashi
Mountain Saki Tetsuya
Kunihiko Higashi