Title:
繊維材料への原子層蒸着
Document Type and Number:
Japanese Patent JP2010510392
Kind Code:
A
Abstract:
A method for depositing an encapsulation layer onto a surface of polymeric fibers and ballistic resistant fabrics. More particularly, the atomic layer deposition of materials onto non-semiconductive polymeric fibers and fabrics, and to fabrics having an conformal encapsulation layer that has been applied by atomic layer deposition.
Inventors:
Parry, Igor
Li, Chen-Way
Butnagar, Ashok
Hurst, david ai
Lao, Jingyu
Li, Chen-Way
Butnagar, Ashok
Hurst, david ai
Lao, Jingyu
Application Number:
JP2009538468A
Publication Date:
April 02, 2010
Filing Date:
November 19, 2007
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
C23C16/40; D06M11/47
Attorney, Agent or Firm:
Shinjiro Ono
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Takamasa Soma
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Takamasa Soma