Title:
複数の波長を用いたレーザアブレーション
Document Type and Number:
Japanese Patent JP2010522082
Kind Code:
A
Abstract:
In laser micromachining and laser defect repair of a first material, a first set of one or more laser wavelengths is selected in accordance with the first material's absorption characteristics and is combined and delivered concurrently with a second set of one or more laser wavelengths which is selected in accordance with the absorption characteristics of a second material generated by and remaining from the ablating interaction of the first material with the first set of laser wavelengths. The concurrent presence of the second set of one or more laser wavelengths removes the residual second material.
Inventors:
Birel, stephen, edward
Application Number:
JP2009554768A
Publication Date:
July 01, 2010
Filing Date:
March 21, 2008
Export Citation:
Assignee:
Photon Dynamics Incorporated
International Classes:
B23K26/36; B23K26/00
Domestic Patent References:
| JP2003285185A | 2003-10-07 | |||
| JP2003260579A | 2003-09-16 | |||
| JP2003275885A | 2003-09-30 | |||
| JPH08155667A | 1996-06-18 | |||
| JP2002248589A | 2002-09-03 | |||
| JP2006198634A | 2006-08-03 | |||
| JP2005095971A | 2005-04-14 | |||
| JP2005205446A | 2005-08-04 | |||
| JPH11307940A | 1999-11-05 |
Foreign References:
| US20060091125A1 | 2006-05-04 | |||
| US6054235A | 2000-04-25 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation