Title:
組立式(modular)浮きプラットフォーム用コネクタ装置
Document Type and Number:
Japanese Patent JP2010526727
Kind Code:
A
Inventors:
Stocks David Tea.
Application Number:
JP2010508342A
Publication Date:
August 05, 2010
Filing Date:
May 14, 2008
Export Citation:
Assignee:
SEMBCORP MARINE LTD
International Classes:
B63B35/38
Domestic Patent References:
| JP2001115416A | 2001-04-24 | |||
| JPS5516148A | 1980-02-04 | |||
| JPS51130585U | 1976-10-21 | |||
| JP2000120054A | 2000-04-25 | |||
| JPS5277391A | 1977-06-29 |
Attorney, Agent or Firm:
Yamato Tsutsui
Yoshitaka Kozuka
Akiko Tsutsui
Yoshitaka Kozuka
Akiko Tsutsui