シリコン/金属複合体マイクロメカニカル構成要素およびこれを製造する方法

Title:

シリコン/金属複合体マイクロメカニカル構成要素およびこれを製造する方法

Document Type and Number:

Japanese Patent JP2011514846

Kind Code:

A

Abstract:

The process for manufacturing a micromechanical component made of silicon/metal composite, comprises selectively carving a cavity in an upper layer (5) of a substrate (3) to define a pattern of a silicon part (53) of the component, carving a cavity in an intermediate layer (9) of the substrate, growing a metallic layer from a portion of the cavities (37, 45) to form a metal part along the thickness of the component, and removing the silicon/metal composite micromechanical component from the substrate. The intermediate layer extends between the upper layer and a lower silicon layer (7). The process for manufacturing a micromechanical component made of silicon/metal composite, comprises selectively carving a cavity in an upper layer (5) of a substrate (3) to define a pattern of a silicon part (53) of the component, carving a cavity in an intermediate layer (9) of the substrate, growing a metallic layer from a portion of the cavities (37, 45) to form a metal part along the thickness of the component, and removing the silicon/metal composite micromechanical component from the substrate. The intermediate layer extends between the upper layer and a lower silicon layer (7) of the substrate. The metallic layer is developed by covering the top of the substrate by a photosensitive resin, selectively carrying out a photolithography process on the photosensitive resin according to the predetermined pattern of the metal part, placing a metallic layer in an upper conductive surface of the lower silicon layer by electroplating process, and removing the photostructured resin from the substrate. The upper surface of the lower layer is made conductive by doping the bottom layer and/or by placing a conductive layer on the upper surface. The photostructured resin makes protrusion in the upper layer of the substrate to continue the growth of a layer by electroplating and to prepare a second metal part of the micromechanical component above the silicon part. The upper side of the substrate is made to a level of the metal layer at a height same as the upper end of the photostructured resin, after forming the metal layer. A cavity is carved in the lower layer of the substrate to form a second silicon part of the micromechanical component according to a predetermined form and thickness, before removing the silicon/metal composite micromechanical component from the substrate. An independent claim is included for a micromechanical component made of silicon/metal composite.

Inventors:

Fiacabbrino, Jean-Charles
Velard, Marco
Cornus, Thierry
Thiebaud, Jean-Philippe
Peters, Jean-Bernard

Application Number:

JP2010533559A

Publication Date:

May 12, 2011

Filing Date:

November 12, 2008

Export Citation:

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