Title:
カプセル封入ユニットを有する装置
Document Type and Number:
Japanese Patent JP2011517302
Kind Code:
A
Abstract:
A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate (1) with at least one functional layer (22), and an electronic component, applying at least one first barrier layer (3) on the functional layer (22) by way of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by way of plasma-enhanced chemical v0apor deposition (PECVD).
Inventors:
Christian schmidt
Tillman Schlenker
Heli belt tool
Ralph Petzold
Marx Klein
Karsten Heuser
Tillman Schlenker
Heli belt tool
Ralph Petzold
Marx Klein
Karsten Heuser
Application Number:
JP2010544582A
Publication Date:
June 02, 2011
Filing Date:
January 29, 2009
Export Citation:
Assignee:
Osram Opto Semiconductors GmbH
International Classes:
B32B9/00; G09F9/30; H01L27/32; H01L51/50; H05B33/04
Domestic Patent References:
| JP2000058777A | 2000-02-25 | |||
| JP2004022281A | 2004-01-22 | |||
| JP2001284042A | 2001-10-12 | |||
| JP2005524946A | 2005-08-18 | |||
| JP2005119148A | 2005-05-12 |
Foreign References:
| WO2006134812A1 | 2006-12-21 |
Attorney, Agent or Firm:
Toshio Yano
Takuya Kuno
Hiroshi Sugimoto
Takahashi
Kimihiro Hoshi
Hiroyasu Ninomiya
Einzel Felix-Reinhard
Takuya Kuno
Hiroshi Sugimoto
Takahashi
Kimihiro Hoshi
Hiroyasu Ninomiya
Einzel Felix-Reinhard