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Title:
耐熱性ポリ乳酸コンパウンド
Document Type and Number:
Japanese Patent JP2011518918
Kind Code:
A
Abstract:
A significant disadvantage of the use of polylactic acid (PLA) has been overcome by the use of styrene maleic anhydride copolymer (SMAC) to cause an unexpected increase in the heat deflection temperature of the PLA compound, surpassing a delta improvement of 5° C. over the heat deflection temperature of the PLA alone, at 66 psi as measured using ASTM D648 when the blended compound is essentially dried prior to use. The compound also often exceeds a threshold of 65° C. in heat deflection temperature. Use of a compatibilizer and impact modifier further improves the industrial versatility of the heat resistant PLA compound. Alternatively, use of calcium carbonate in the heat resistant PLA compound also is industrially valuable.

Inventors:
Chu, Sion
McDaniel, Charles W.
Abakian, Roger W..
Application Number:
JP2011506369A
Publication Date:
June 30, 2011
Filing Date:
April 17, 2009
Export Citation:
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Assignee:
Poly One Corporation
International Classes:
C08L67/04; C08J3/20; C08K3/26; C08L25/08; C08L33/04; C08L55/02; C08L101/16
Domestic Patent References:
JP2002509968A2002-04-02
JP2006161024A2006-06-22
JP2007046019A2007-02-22
JP2006328318A2006-12-07
JP2003261756A2003-09-19
JP2006328318A2006-12-07
JP2003261756A2003-09-19
JP2002509968A2002-04-02
JP2006161024A2006-06-22
JP2007046019A2007-02-22
Foreign References:
WO2006097979A12006-09-21
WO2006097979A12006-09-21
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita