Title:
リガンド官能化基材
Document Type and Number:
Japanese Patent JP2011523965
Kind Code:
A
Abstract:
Ligand functionalized substrates, methods of making ligand functionalized substrates, and methods of using functionalized substrates are disclosed.
Inventors:
Etozel, Mark Earl.
Hey
Haleman, Stephen M.
Rasmussen, Gerald K.
Seshadodri, canan
Shannon, Simon K.
Waller, Clinton Pea., Junior
Weiss, Douglas E.
Hey
Haleman, Stephen M.
Rasmussen, Gerald K.
Seshadodri, canan
Shannon, Simon K.
Waller, Clinton Pea., Junior
Weiss, Douglas E.
Application Number:
JP2011511777A
Publication Date:
August 25, 2011
Filing Date:
May 27, 2009
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
Wisconsin Alumni Research Foundation
Wisconsin Alumni Research Foundation
International Classes:
C08J7/00; B01D15/08; B01D71/26; B01D71/34; B01D71/56; B01D71/78; B01D71/82; B01J20/22; B01J20/26; B01J20/281; D06M14/28; D06M14/34; G01N30/88
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Nagasaka Tomoyasu
Satoshi Deno
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Nagasaka Tomoyasu
Satoshi Deno