Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
軽量壁修理用混合物
Document Type and Number:
Japanese Patent JP2011523974
Kind Code:
A
Abstract:
Herein are disclosed wall repair compounds comprising at least one or more polymeric binder latex emulsions, one or more inorganic fillers, and comprising an amount of organic polymeric thickener that is less than about 0.1 percent by weight based on the total weight of the wall repair compound. In certain embodiments, the wall repair compound comprises an inorganic filler system selected such that such that synthetic inorganic fillers comprise essentially 100 percent of the inorganic filler used. In certain embodiments, the wall repair compound comprises one or more glycol ether smoothing agents.

More Like This:
JP2009241387SUBSTRATE WITH COATING CONTAINING HOLLOW SILICONE BASE PARTICULATE BY WHICH DISTRIBUTION OF PARTICLE DIAMETER AND POROSITY WAS CONROLED
JP6652968Aqueous dispersion mixture
WO/1998/055551IMPROVED KAOLIN COMPOSITION FOR USE IN ELECTRODEPOSITION PAINTS
Inventors:
Goth, John Yee.
Malo, Richard A.
Application Number:
JP2011513556A
Publication Date:
August 25, 2011
Filing Date:
June 01, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
C09D201/00; C04B41/63; C09D5/02; C09D7/12; C09D133/00; C09D191/00; E04F13/02
Domestic Patent References:
JPH08127736A1996-05-21
JP2010522261A2010-07-01
JP2005500967A2005-01-13
JP2008095031A2008-04-24
JPH06287544A1994-10-11
JPH07278463A1995-10-24
JP2002531369A2002-09-24
JPH06287544A1994-10-11
JPH07278463A1995-10-24
JP2002531369A2002-09-24
JPH08127736A1996-05-21
JP2010522261A2010-07-01
JP2005500967A2005-01-13
JP2008095031A2008-04-24
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Atsushi Ebiya



 
Previous Patent: 耐衝撃性が改良された生分解性ポリマー組成物

Next Patent: 多区画パウチ