Title:
圧電ファイバのアクティブダンピングされる複合材料の電子ハウジング
Document Type and Number:
Japanese Patent JP2011526989
Kind Code:
A
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Inventors:
Fasiano, Andrew Bee.
Moore, Robert Tee.
Flavasek, Greg Jay.
Seasley, Craig Day.
Moore, Robert Tee.
Flavasek, Greg Jay.
Seasley, Craig Day.
Application Number:
JP2011516243A
Publication Date:
October 20, 2011
Filing Date:
July 02, 2008
Export Citation:
Assignee:
RAYTHEON COMPANY
International Classes:
F16F15/02; F42B15/01
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Katsu Sunagawa
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Katsu Sunagawa