Title:
高密度構造体の形成方法
Document Type and Number:
Japanese Patent JP2011528502
Kind Code:
A
Abstract:
The invention relates to a method of forming a high density structure comprising the steps of providing a substrate (2) wherein the high density structure is to be formed with a release liner (3), said release liner being self-removable; forming at least one cavity (5a, 5b) in the substrate through the release liner, said at least one cavity forming at least a part of the high density structure; at least partially filling the at least one cavity with a filler material (7a, 7b); removing the release liner from the substrate (2).
Inventors:
Van denbrandt, yolen
Dietzel, Andreas Heinrich
Dietzel, Andreas Heinrich
Application Number:
JP2011518672A
Publication Date:
November 17, 2011
Filing Date:
July 14, 2009
Export Citation:
Assignee:
Nederland's Organisati Fall Toge Pastona Tour Vetten Schapereek on Dell Souk Teenau
International Classes:
H05K3/10; H05K3/24
Domestic Patent References:
| JP2006060150A | 2006-03-02 | |||
| JPH05185269A | 1993-07-27 | |||
| JP2007520070A | 2007-07-19 | |||
| JP2003133743A | 2003-05-09 |
Attorney, Agent or Firm:
Patent Business Corporation Takewa International Patent Office