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Title:
静電放電に対する保護を有する放射放出半導体チップおよびその製造方法
Document Type and Number:
Japanese Patent JP2011528855
Kind Code:
A
Abstract:
A radiation-emitting semiconductor chip includes: a carrier and a semiconductor body with a semiconductor layer sequence including an active region that generates radiation, a first semiconductor layer and a second semiconductor layer; wherein the active region is arranged between the first semiconductor layer and the second semiconductor layer; the first semiconductor layer is arranged on a side of the active region which faces away from the carrier; the semiconductor body comprises at least one recess which extends through the active region; the first semiconductor layer is electrically conductively connected to a first connection layer extending in the recess from the first semiconductor layer in a direction of the carrier; and the first connection layer is electrically connected to the second semiconductor layer via a protective diode.

Inventors:
Engel curl
Hahn belt hold
Strobel Klaus
Klein Marx
Application Number:
JP2011519023A
Publication Date:
November 24, 2011
Filing Date:
June 25, 2009
Export Citation:
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Assignee:
Osram Opto Semiconductors GmbH
International Classes:
H01L33/02; H01L27/15; H01S5/02
Domestic Patent References:
JP2006108682A2006-04-20
JP2007294981A2007-11-08
JP2007512689A2007-05-17
Attorney, Agent or Firm:
Koichi Washida