Title:
光学的に透明なビアを充填する改良された方法及び装置
Document Type and Number:
Japanese Patent JP2012500145
Kind Code:
A
Abstract:
A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit.
Inventors:
Simmenson, Glenn, F.
Antoni, william
Steve Cohen
Jeffer Howerton
Antoni, william
Steve Cohen
Jeffer Howerton
Application Number:
JP2011523992A
Publication Date:
January 05, 2012
Filing Date:
August 20, 2009
Export Citation:
Assignee:
Electro Scientific Industries, Inc.
International Classes:
B29D11/00
Foreign References:
| WO2007142877A2 | 2007-12-13 | |||
| WO2007142909A2 | 2007-12-13 |
Attorney, Agent or Firm:
Yusuke Hiraki
Sekiya Mitsuo
Toshiaki Watanabe
Hidekazu Matsumaru
Sekiya Mitsuo
Toshiaki Watanabe
Hidekazu Matsumaru