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Patent Searching and Data


Title:
温度安定性接着剤層の形成下での構成部材(Bauteilen)の接着法
Document Type and Number:
Japanese Patent JP2012500878
Kind Code:
A
Abstract:
A method for gluing components is provided, forming an adhesive layer which is capable of functioning, at least in a temperature range of ≧100° C. to ≰160° C., wherein the adhesive layer is obtained from a curable reactive resin system. The reactive resin system includes an epoxy resin component and polymer particles dispersed in the epoxy resin component, the dispersed polymer particles furthermore including addition-crosslinked silicone elastomer. Also provided is the use of a reactive resin system for gluing piezoelectric ceramics and/or permanent magnets including rare earth elements and a component configuration including a piezoelectric ceramic, an impedance matching layer and an adhesive layer in contact with the piezoelectric ceramic and the impedance matching layer.

Inventors:
Laurent Muller
Irene Jenrich
Gerhard Hughtre
Patrick Steyr
Application Number:
JP2011524335A
Publication Date:
January 12, 2012
Filing Date:
August 21, 2009
Export Citation:
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Assignee:
ROBERT BOSCH GMBH
International Classes:
C09J163/00; C09J5/00; C09J11/04; C09J11/06; C09J163/02; C09J183/04; H04R17/00
Domestic Patent References:
JPS5996122A1984-06-02
JPH07165980A1995-06-27
JP2005171002A2005-06-30
JP2003176459A2003-06-24
JP2003173910A2003-06-20
JP2001129990A2001-05-15
JPH04300254A1992-10-23
JPS6487679A1989-03-31
Foreign References:
WO2008016889A12008-02-07
WO2008060545A12008-05-22
WO2009022574A12009-02-19
Attorney, Agent or Firm:
Takuya Kuno
Toshio Yano
Takahashi
Kimihiro Hoshi
Hiroyasu Ninomiya
Ryoichi Shino
Einzel Felix-Reinhard