Title:
ポリイミドフィルム
Document Type and Number:
Japanese Patent JP2012503701
Kind Code:
A
Abstract:
Disclosed is a polyimide film, which is very transparent and very resistant to heat and thus undergoes little dimensional change under thermal stress, and is suitable for use in transparent conductive films, TFT substrates, flexible printed circuit boards and so on.
Inventors:
Cho, Hanmun
Park, Hyo Jun
John, Yong Han
Park, Hyo Jun
John, Yong Han
Application Number:
JP2011528937A
Publication Date:
February 09, 2012
Filing Date:
September 25, 2009
Export Citation:
Assignee:
Kolon Industries Inc.
International Classes:
C08J5/18; C08G73/10
Domestic Patent References:
| JP2007046054A | 2007-02-22 | |||
| JP2006306973A | 2006-11-09 | |||
| JP2006057108A | 2006-03-02 | |||
| JP2000313804A | 2000-11-14 | |||
| JPH07292105A | 1995-11-07 | |||
| JPH09258043A | 1997-10-03 |
Foreign References:
| WO2008072916A1 | 2008-06-19 | |||
| WO2008072914A1 | 2008-06-19 |
Attorney, Agent or Firm:
Yamashita
Kyoko Fujino
Kyoko Fujino