Title:
ウェーハの微小割れを検出するための装置およびそのための方法
Document Type and Number:
Japanese Patent JP2012510155
Kind Code:
A
Abstract:
A method and apparatus for wafer inspection is disclosed. The method and apparatus involve directing light substantially along a first axis towards a first surface of a wafer to thereby obtain light emanating along the first axis from a second surface of the wafer, wherein the first and second surfaces of the wafer are substantially outwardly opposing and substantially extending parallel to a plane. The method and apparatus further involve directing light substantially along a second axis towards the first surface of the wafer to thereby obtain light emanating along the second axis from the second surface of the wafer, the first axis being angled away from the second axis about a reference axis extending along the plane. More specifically, the orthographic projection of the first axis on the plane is substantially parallel to the orthographic projection of the second axis on the plane, and each the orthographic projections of the first and second axes on the plane is substantially orthogonal to the reference axis.
Inventors:
Chan, Sokren
Application Number:
JP2011537399A
Publication Date:
April 26, 2012
Filing Date:
May 15, 2009
Export Citation:
Assignee:
Bull Planet PTT Limited
International Classes:
H01L21/66
Domestic Patent References:
| JP2001024040A | 2001-01-26 | |||
| JP2001024040A | 2001-01-26 | |||
| JP2006184177A | 2006-07-13 | |||
| JP2008198966A | 2008-08-28 |
Foreign References:
| EP1956366A1 | 2008-08-13 | |||
| EP1956366A1 | 2008-08-13 |
Attorney, Agent or Firm:
▲吉▼川 俊雄