Title:
フレキシブルプリント回路板のための液体カバーレイ
Document Type and Number:
Japanese Patent JP2012520917
Kind Code:
A
Abstract:
The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
Inventors:
Stephen Anthony Hall
Richard Charles Davis
Simon Richard Ford
Matthias Claus
Karl-Heinz Ogniveni
Richard Charles Davis
Simon Richard Ford
Matthias Claus
Karl-Heinz Ogniveni
Application Number:
JP2012500315A
Publication Date:
September 10, 2012
Filing Date:
March 16, 2010
Export Citation:
Assignee:
Sun Chemical Besloten Fennaught Shap
International Classes:
C08G18/80; C08L75/04; C09D7/47; C09D163/00; C09D175/04; C09D179/08; H05K3/28
Domestic Patent References:
| JPS5880326A | 1983-05-14 | |||
| JPS62263692A | 1987-11-16 | |||
| JPH03181511A | 1991-08-07 | |||
| JP2009149757A | 2009-07-09 |
Foreign References:
| WO2008072495A1 | 2008-06-19 | |||
| WO2008052688A2 | 2008-05-08 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Nagasaka Tomoyasu
Shunsuke Mima
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Nagasaka Tomoyasu
Shunsuke Mima