Title:
複数スパッタ源を有する反応性スパッタリング
Document Type and Number:
Japanese Patent JP2012525492
Kind Code:
A
Abstract:
The apparatus (1) for coating a substrate (14) by reactive sputtering comprises an axis (8), at least two targets (11,12) in an arrangement symmetrically to said axis (8) and a power supply connected to the targets (11,12), wherein the targets are alternatively operable as cathode and anode. The method is a method for manufacturing a coated substrate (14) by coating a substrate (14) by reactive sputtering in an apparatus (1) comprising an axis (8). The method comprises a) providing a substrate (14) to be coated; b) providing at least two targets (11,12) in an arrangement symmetrically to said axis (8); c) alternatively operating said targets (11,12) as cathode and anode during coating. Preferably, the targets (11,12) are rotated during sputtering and/or the targets are arranged concentrically, with an innermost circular target surrounded by at least one ring-shaped outer target.
Inventors:
Dubus, Martin
Rume, Kurt
Rorman, Hartmut
Rume, Kurt
Rorman, Hartmut
Application Number:
JP2012507694A
Publication Date:
October 22, 2012
Filing Date:
April 23, 2010
Export Citation:
Assignee:
OC Oerlikon Balzers AG
International Classes:
C23C14/34
Attorney, Agent or Firm:
Fukami patent office