Title:
粒子強化重合体組成物
Document Type and Number:
Japanese Patent JP2012528237
Kind Code:
A
Abstract:
Particle-toughened polymer compositions include a base polymer formulation and a plurality of toughening particles. In certain embodiments, the base polymer formulation includes bismaleimides or other polymer resins capable of high temperature service. A first plurality of toughening particles may include core shell rubbers. A second plurality of toughening particles may be selected from a variety of polymer compositions, including polyimides, polyether ketone (PEK), polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polyether imide, polyether sulfones, and polyphenylene oxide. It is found that increasing concentration of the core shell rubbers may improve the toughness of the composition while preserving thermal properties of the composition, such as glass transition temperature.
Inventors:
Boneau, Mark Lichyard
Boyd, Jack Douglas
Emerson, Gordon Thomas
Lucas, Scott Day
Howard, Stephen The Eicob
The Eicobs, Spencer Donald
Boyd, Jack Douglas
Emerson, Gordon Thomas
Lucas, Scott Day
Howard, Stephen The Eicob
The Eicobs, Spencer Donald
Application Number:
JP2012513191A
Publication Date:
November 12, 2012
Filing Date:
May 26, 2010
Export Citation:
Assignee:
Psytech Technology Corporation
International Classes:
C08L101/00; C08K5/08; C08L51/00; C08L87/00
Domestic Patent References:
| JPH03197559A | 1991-08-28 | |||
| JP2009097013A | 2009-05-07 | |||
| JP2000500795A | 2000-01-25 | |||
| JPH03197559A | 1991-08-28 | |||
| JP2009097013A | 2009-05-07 | |||
| JP2000500795A | 2000-01-25 |
Foreign References:
| EP0816438A2 | 1998-01-07 | |||
| EP0816438A2 | 1998-01-07 |
Attorney, Agent or Firm:
Patent business corporation Odashima patent office