Title:
イオン化されない熱活性ナノ触媒を含む化学機械的研磨スラリー組成物及びこれを用いた研磨方法
Document Type and Number:
Japanese Patent JP2012529174
Kind Code:
A
Abstract:
Disclosed herein are a chemical mechanical polishing slurry composition for chemical mechanical planarization of metal layers, which comprises a non-ionized, heat-activated nano-catalyst, and a polishing method using the same. The polishing slurry composition comprises: a non-ionized, heat-activated nano-catalyst which releases electrons and holes by energy generated in a chemical mechanical polishing process; an abrasive; and an oxidizing agent. The non-ionized, heat-activated nano-catalyst and the abrasive are different from each other, and the non-ionized, heat-activated nano-catalyst is preferably a semiconductor material which releases electrons and holes at a temperature of 10 to 100 °C in an aqueous solution state, more preferably a transition metal silicide selected from the group consisting of CrSi, MnSi, CoSi, ferrosilicon (FeSi), mixtures thereof, and most preferably, a semiconductor material such as nano ferrosilicon. The content of the content of the non-ionized, heat-activated nano-catalyst is 0.00001 to 0.1 wt% based on the total weight of the slurry composition.
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Inventors:
Park, Jongde
Im, Jin Hyuk
Choi, Jong Min
Kong, Hyun
Kim, Jae Hyun
Park, Haejeong
Im, Jin Hyuk
Choi, Jong Min
Kong, Hyun
Kim, Jae Hyun
Park, Haejeong
Application Number:
JP2012513862A
Publication Date:
November 15, 2012
Filing Date:
May 27, 2010
Export Citation:
Assignee:
Dongjin Semichem Co.,Ltd.
International Classes:
H01L21/304; B24B37/00; C09K3/14
Foreign References:
| US20090120012A1 | 2009-05-14 | |||
| US20050282471A1 | 2005-12-22 | |||
| KR20060117696A | 2006-11-17 |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office