Title:
EUVまたはUVリソグラフィ装置の部材及びその製造方法
Document Type and Number:
Japanese Patent JP2013500593
Kind Code:
A
Abstract:
To improve the bonding of two parts (401, 403) of a component (400) of an EUV or UV lithography apparatus such that the probability of occurrence of additional stress over time in the bonded parts (401, 403) is lessened, a component (400) of an EUV or UV lithography apparatus comprising two parts (401, 403) bonded to each other by adhesive material (405) is proposed, wherein the adhesive material (405) is coated with a protective layer (407) insulating the adhesive material (405) from the surrounding gas environment.
Inventors:
Hin Yu Antony Chun
Application Number:
JP2012521968A
Publication Date:
January 07, 2013
Filing Date:
July 30, 2009
Export Citation:
Assignee:
Carl Zeiss SGM Gaehha
International Classes:
H01L21/027; G02B7/02; G02B7/182; G03F7/20
Domestic Patent References:
| JPH1114876A | 1999-01-22 | |||
| JPH11211958A | 1999-08-06 | |||
| JP2000139819A | 2000-05-23 | |||
| JPWO9949366A1 | ||||
| JP2009009100A | 2009-01-15 |
Foreign References:
| US20060033984A1 | 2006-02-16 | |||
| US6869733B1 | 2005-03-22 |
Attorney, Agent or Firm:
Kenji Sugimura
Tatsuya Sawada
Ryukei Kawai
Tatsuya Sawada
Ryukei Kawai