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Patent Searching and Data


Title:
微細回路の形成のためのエンベデッド用銅箔
Document Type and Number:
Japanese Patent JP2013503965
Kind Code:
A
Abstract:
Proposed is a copper foil for an embedded pattern, which has no nodule, and which comprises: a copper carrier layer; a barrier layer formed at one surface of the copper carrier layer; and a seed layer formed at a surface of the barrier layer to form a circuit. The barrier layer is a nickel layer or a nickel alloy layer, and the seed layer is a copper layer. The surface of the seed layer has an average roughness Rz of less than 1.5 µm, and Rmax of less than 2.5 µm.

Inventors:
Ryu Jong Ho
Yang Chang-yeol
Application Number:
JP2012526669A
Publication Date:
February 04, 2013
Filing Date:
August 31, 2010
Export Citation:
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Assignee:
Iljin Copper Wheel Company Limited
International Classes:
C25D1/10; C25D3/38; C25D5/12; C25D7/06; H05K3/20
Domestic Patent References:
JP2004162172A2004-06-10
Foreign References:
WO2008126522A12008-10-23
Other References:
JPN6013063175; 福富直樹 他5名: '特集 MCM/LSI実装技術 MCM/LSI実装用プリント配線板製造プロセス 転写法配線板' サーキット テクノロジ Vol.9 No.5, 199408, Page.369-376, 一般社団法人 エレクトロニクス実装学会
Attorney, Agent or Firm:
Masu Kobori
Takato Tsutsumi