Title:
オプトエレクトロニクス部品
Document Type and Number:
Japanese Patent JP2013506976
Kind Code:
A
Abstract:
The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a contact metallization (3a, 3b), wherein —the carrier (1) is electrically insulating, —the at least one optoelectronic semiconductor chip (2) is fastened to the first main surface (Ia) of the carrier (1) by means of a bonding material (4), particularly a solder material, —the contact metallization (3a, 3b) covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (2), and —the contact metallization (3a, 3b) is electrically conductively connected to the optoelectronic semiconductor chip (2).
Inventors:
Mueller Claus
Space Gunter
Hermann Siegfried
Gunther Ewald Carl Michael
Bruner Herbert
Space Gunter
Hermann Siegfried
Gunther Ewald Carl Michael
Bruner Herbert
Application Number:
JP2012531310A
Publication Date:
February 28, 2013
Filing Date:
August 31, 2010
Export Citation:
Assignee:
Osram Opto Semiconductors GmbH
International Classes:
H01L33/48
Domestic Patent References:
| JP2006344971A | 2006-12-21 | |||
| JP2004363279A | 2004-12-24 | |||
| JP2008294224A | 2008-12-04 | |||
| JP2002335020A | 2002-11-22 | |||
| JP2009049267A | 2009-03-05 | |||
| JP2003078170A | 2003-03-14 | |||
| JP2005322722A | 2005-11-17 | |||
| JP2006313825A | 2006-11-16 | |||
| JP2009117536A | 2009-05-28 |
Attorney, Agent or Firm:
Koichi Washida