Title:
高い耐電力性及び高い導電性を有するメタライジング層
Document Type and Number:
Japanese Patent JP2013513232
Kind Code:
A
Abstract:
A metallization, for carrying current in an electrical component, includes a bottom layer overlying a substrate surface and includes titanium (Ti) or a titanium compound as main constituent. An upper layer overlies the bottom layer and includes copper (Cu) as main constituent. The bottom layer and the upper layer form a base layer. A top layer is in direct contact with the upper layer and includes aluminum (Al) as main constituent. The base layer further includes a middle layer, consisting of silver, that is arranged between the bottom layer and the upper layer.
Inventors:
Charles Vininger
Ulrich Knauer
Helmut Zottle
Warner Luile
Thomas jeura
Rudolf Nussle
Ulrich Knauer
Helmut Zottle
Warner Luile
Thomas jeura
Rudolf Nussle
Application Number:
JP2012541486A
Publication Date:
April 18, 2013
Filing Date:
December 01, 2010
Export Citation:
Assignee:
EPCOS AG
International Classes:
H05K1/09; H05K1/16; H03H3/08; H03H9/145
Domestic Patent References:
| JP2002026685A | 2002-01-25 | |||
| JPH0473994A | 1992-03-09 | |||
| JP2005253034A | 2005-09-15 | |||
| JPS6378591A | 1988-04-08 | |||
| JP2007134932A | 2007-05-31 |
Attorney, Agent or Firm:
Kenji Sugimura
Akito Okura
Yuro Yoshizawa
Akito Okura
Yuro Yoshizawa