Title:
スパッタリングターゲットの構成要素の接合方法、スパッタリングターゲットの構成要素の接合アセンブリ、および接合アセンブリの使用
Document Type and Number:
Japanese Patent JP2013528709
Kind Code:
A
Abstract:
The invention describes a method for bonding components of a sputtering target, comprising the following steps: providing a first component and a second component, the harder of which has undercut protrusions; positioning them against each other; and pressing them towards each other resulting in a plastic deformation of the material of at least one of the two components, filling the undercuts thereby creating interlocking, as well as the bonded assembly so created, and its recycling. No step creating bonding other than interlocking on a major part of the bonded surface area is necessary.
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Inventors:
Linsboat, Robert
Application Number:
JP2013514738A
Publication Date:
July 11, 2013
Filing Date:
June 17, 2011
Export Citation:
Assignee:
Umicore Ese.
International Classes:
C23C14/34
Domestic Patent References:
| JP2006508239A | 2006-03-09 | |||
| JP2003535212A | 2003-11-25 |
Foreign References:
| US20040113364A1 | 2004-06-17 | |||
| US20040056070A1 | 2004-03-25 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Kensaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa