Title:
研磨材用の加工液
Document Type and Number:
Japanese Patent JP2013534262
Kind Code:
A
Abstract:
The invention relates to improved novel carrier fluids for abrasives, especially cutting fluids, for wafer production. The invention also relates to the use of said fluids and to a method for cutting wafers.
Inventors:
Hans-Peter Zehlmann-Egebeath
Andreas Zenf
Marks thresh
Joachim Bentele
Katy Schmidt
Oud Stefanowski
Andreas Zenf
Marks thresh
Joachim Bentele
Katy Schmidt
Oud Stefanowski
Application Number:
JP2013522230A
Publication Date:
September 02, 2013
Filing Date:
August 02, 2011
Export Citation:
Assignee:
BASF SE
International Classes:
C10M169/04; B24B37/00; C10M105/18; C10M107/34; H01L21/304; C10N30/00; C10N40/22
Domestic Patent References:
| JPH11323376A | 1999-11-26 | |||
| JPH11286693A | 1999-10-19 | |||
| JP2000044974A | 2000-02-15 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Takuya Kuno
Takuya Kuno