Title:
メタライゼーション処理、混合物、および、電子デバイス
Document Type and Number:
Japanese Patent JP2013538287
Kind Code:
A
Abstract:
One aspect of the present invention is a method of processing a substrate. In one embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electroless deposition solution and electrolessly depositing a metal matrix and co-depositing the metal particles. In another embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electrochemical plating solution and electrochemically plating a metal matrix and co-depositing the metal particles. Another aspect of the present invention is a mixture for the formation of an electrical conductor on or in a substrate. Another aspect of the present invention is an electronic device.
Inventors:
Corix Artur
Redeker Fritz
Redeker Fritz
Application Number:
JP2013519184A
Publication Date:
October 10, 2013
Filing Date:
July 01, 2011
Export Citation:
Assignee:
LAM RESEARCH CORPORATION
International Classes:
C23C18/31; C23C18/52; C25D7/12; C25D15/02; H01L21/288; H01L21/3205; H01L21/768; H01L23/532
Domestic Patent References:
| JP2008544077A | 2008-12-04 | |||
| JP2008544077A | 2008-12-04 |
Attorney, Agent or Firm:
Meisei International Patent Office
Yoshinobu Inoue
Yoshinobu Inoue