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Title:
鋳造用中子及び鋳型製造のための置換ベンゼン及びナフタレンを含有するバインダー、モールド材混合物及び方法
Document Type and Number:
Japanese Patent JP2013540863
Kind Code:
A
Abstract:
A binder for mold material mixtures is a four-component material. It contains at least one phenolic resin component, at least one isocyanate component, at least one alkyl/alkenyl benzene and at least one dialkylated and/or dialkenylated naphthalene. The phenolic resin component acts as the polyol component and contains phenolic resin obtainable from the reaction between a phenol compound and an aldehyde compound. The isocyanate component contains at least one polyisocyanate with at least two NCO groups per molecule. The alkyl/alkenyl benzene has a boiling point above 250° C. The dialkylated and/or dialkenylated naphthalene has a boiling point above 270° C.

Inventors:
Prive, Christian
Koch, Dietel
Application Number:
JP2013530566A
Publication Date:
November 07, 2013
Filing Date:
September 30, 2011
Export Citation:
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Assignee:
ASK Chemicals Gezel Shaft Mitt Beschlenktel Haftung
International Classes:
C08G18/54; B22C1/22; C08K3/00; C08K5/01; C08L75/04
Domestic Patent References:
JPS61502387A1986-10-23
JPH10139818A1998-05-26
JP2001511707A2001-08-14
JPS61111742A1986-05-29
JPS4832253B11973-10-04
JPS5978136A1984-05-04
JP2010516470A2010-05-20
JP2007313518A2007-12-06
JP2002113549A2002-04-16
JP2005517075A2005-06-09
JP2007537340A2007-12-20
Foreign References:
US20050256288A12005-11-17
WO1998019809A11998-05-14
US4546124A1985-10-08
US3632844A1972-01-04
US6288139B12001-09-11
US4590229A1986-05-20
US4420643A1983-12-13
US4079031A1978-03-14
US6429236B12002-08-06
US20100126690A12010-05-27
US20050038162A12005-02-17
Attorney, Agent or Firm:
Kimura Mitsuru
Takuji Harada
Takanori Mamoru
Taiji Morikawa
Amamiya Yasuhito
Kei Sakurada
Mie Hideki



 
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