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Title:
熱伝達装置、ならびに関連したシステムおよび方法
Document Type and Number:
Japanese Patent JP2013545956
Kind Code:
A
Abstract:
Embodiments of thermal transfer devices and associated systems and methods are disclosed herein. In one embodiment, a thermal transfer system can include a conduit that has an input portion, an output portion, and a sidewall between the input and output portions. Heat can enter the conduit at the input portion and exit the conduit at the output portion. The thermal transfer system can further include an end cap proximate to a terminus of the conduit. A working fluid can circulate through the conduit utilizing a vaporization-condensation cycle. The thermal transfer device can also include an architectural construct having a plurality of parallel layers of a synthetic matrix characterization of a crystal.

Inventors:
Roy Edward McAllister
Application Number:
JP2012553091A
Publication Date:
December 26, 2013
Filing Date:
February 14, 2011
Export Citation:
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Assignee:
McAlister Technologies LLC
International Classes:
F28D15/02; F28D15/06
Domestic Patent References:
JP2006511782A2006-04-06
JP2007327719A2007-12-20
JP2004340453A2004-12-02
JPS63124507U1988-08-15
JP2003240462A2003-08-27
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JP2000130969A2000-05-12
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JPS57139292A1982-08-28
JPS54108052A1979-08-24
JPS5184449A1976-07-23
JPH11351770A1999-12-24
JPH09119789A1997-05-06
JPH04222706A1992-08-12
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JP2007335514A2007-12-27
JPS5713971U1982-01-25
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JP2002013888A2002-01-18
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Foreign References:
US3786861A1974-01-22
CN2773601Y2006-04-19
US20090084526A12009-04-02
WO2009037928A12009-03-26
US4109709A1978-08-29
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office