Title:
HEAT PUMP SYSTEM
Document Type and Number:
Japanese Patent JP2014126216
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heat pump system capable of performing heat transfer with fewer energy.SOLUTION: A heat pump system includes: a circulation circuit 10 in which a heat medium containing triazole metal complex represented by a general formula (1) circulates inside, and that is arranged to extend over a low temperature side and a high temperature side; a low-temperature-side heat exchanger 11 provided on the low temperature side of the circulation circuit 10, and transferring heat from outside to the heat medium; and a high-temperature-side heat exchanger 12 provided on the high-temperature side of the circulation circuit 10, and emitting heat from the heat medium to the outside. (In general formula (1), R1 represents an alkyl group, R2 represents an alkylene group, M represents a metal ion, and X represents an anion.
Inventors:
IWASE KATSUNORI
IIJIMA TAKESHI
KIMIZUKA NOBUO
IIJIMA TAKESHI
KIMIZUKA NOBUO
Application Number:
JP2012280745A
Publication Date:
July 07, 2014
Filing Date:
December 25, 2012
Export Citation:
Assignee:
DENSO CORP
UNIV KYUSHU
UNIV KYUSHU
International Classes:
F28D15/02; C09K5/06
Domestic Patent References:
| JPH05283880A | 1993-10-29 | |||
| JPH0658646A | 1994-03-04 | |||
| JPS61208490A | 1986-09-16 | |||
| JP2007131673A | 2007-05-31 | |||
| JP2002005536A | 2002-01-09 | |||
| JPH11512810A | 1999-11-02 | |||
| JPH05283880A | 1993-10-29 | |||
| JPH0658646A | 1994-03-04 | |||
| JPS61208490A | 1986-09-16 | |||
| JP2007131673A | 2007-05-31 | |||
| JP2002005536A | 2002-01-09 | |||
| JPH11512810A | 1999-11-02 |
Attorney, Agent or Firm:
Patent Business Corporation Kaisei Patent Office